Abstract: Ever increasing fraction of the energy consumption of an Integrated circuit is due to the interconnect wires (and the associated driver and receiver circuits). Power dissipation from the interconnect wires amounts to up to 40% of the total on-chip power dissipation in some gate array design styles. When compared with other techniques a diode-connected driver circuit has the best attributes over other low-swing signaling techniques in terms of power, and delay. The proposed signaling schemes of symmetric low-swing driver-receiver pairs (MJ-SIB) and (MJDB) for driving signals on the global interconnect lines, which are implemented using split R-π model for an interconnect line, provides best results.