International Journal of Scientific and Research Publications

IJSRP, Volume 6, Issue 10, October 2016 Edition [ISSN 2250-3153]


Modeling and Simulation of Material Removal on Glass While Machining Through ECDM
      Sachin Kumar
Abstract: Industrial applications of glass and ceramic materials have increased manifold due to their relatively low friction, high compression strength, high temperature and wear resistance, and excellent chemical inertness, etc. In micro-electromechanical systems (MEMS) the use of glass, along with silicon and polymer, has become very popular. However, micro-fabrication of glass is a difficult process. The electrochemical discharge machining (ECDM) is now often used as one of the chip less machining solutions for these materials. The ECDM, however, is a complex process with multiple controllable parameters and exhibits stochastic nature. The mechanism of material removal in the process is yet to be understood well in spite of many theories.

Reference this Research Paper (copy & paste below code):

Sachin Kumar (2018); Modeling and Simulation of Material Removal on Glass While Machining Through ECDM; Int J Sci Res Publ 6(10) (ISSN: 2250-3153). http://www.ijsrp.org/research-paper-1016.php?rp=P585902
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